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LatestProducts
10 Layer PCB Circuit Board with BGA and Impedance Control
Gold Finger PCB, Beveling & Chamfer, Small BGA
Description
Basic Info
- Model NO.: WBPN1033AO
- Dielectric: FR-4
- Application: Computer
- Mechanical Rigid: Rigid
- Base Material: Copper
- Brand: Xzg
- Solder Mask Colour: Green
- Trademark: XZG
- Specification: IPC-Class 2
- HS Code: 8534009000
- Type: Rigid Circuit Board
- Material: Fiberglass Epoxy
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Insulation Materials: Epoxy Resin
- Demension: 46*136mm
- Silkscreen Colour: White
- Transport Package: Vaccume Package
- Origin: Guangdong, China
Product Description
Specifiction:
layer:10 layer
Material:Fr4 it170
TG value:tg170
board thickness:1.6mm
copper thickness:1.5oz
min BGA size:0.25mm
min line width and distance:4/4mil
min Hole size:0.2mm
surface treatment: gold finger +imersion gold
Why US:
- UL (E246887), ISO9001, TS16949, ISO 14001 certified.
- Turnover USD 50-100 million per year
- 25,000 sqm area,1100 staff
- Mass Production from single to 20 layers
- Special Material: ROGERS, Arlon, Taconic.etc.
- Client: SAMSUNG, Skyworth, Malata, Midea.etc.
Capability & Lead Time:
Certificates(UL:E246887, TS16949, ISO14001, ISO9001):
Clients and Suppliers:
FAQ:
Q1:Are you a manufacturer or trading company?
A:XingZhiGuang is a PCB manufacturer, specialized in PCB for over ten years.
Q2:What kind of PCB file you need before production
A:Gerber, or files like PROTEL 99SE, PROTEL DXP, POWER PCB, CAM350.etc.
b. Dimensional Specifications
c. BOM List (only for PCBA)
Q3: How long will you send us quotation ?
A: After all files were sent, 2 to 8 hours as per your file.
Q4:What is your minimum order quantity?
A:Our MOQ is 1 PCS.
Q5: How to find you?
A: Please click the button "send" at the end of each page, or contact our sales on Trade Manage online!